LADAZ Silicon
Pin map in.
Fab‑ready out.
Package substrates and test hardware, designed mostly by software, for chip teams that have no packaging group.
The problem
The chip is ready. The package isn't.
Start-ups and small fabless teams have no in-house package or test-hardware designer. The work joins a queue at an OSAT or design house, billed by the person-day and routed by hand. If one pin moves, the work starts over.
Why now
AI chips turned test into the bottleneck.
Sources: Wing VC (May 2026); Teradyne Q4 2025 earnings call; TrendForce supply-chain reports (2025–26).
Product
One flow, from pin map
to fab files.
Inputs from any tool
Pin map, layer stack and the vendor's rule sheet. No proprietary EDA licence needed.
Rule packs with provenance
Every rule records the vendor, version and line, so each error traces back to its source.
Deterministic routing
Ball assignment, escape and detailed routing by tested engines.
Intent and replay
Designer intent is stored as data. When an input changes, the design re-runs and the engineer approves what moved.
Fab-ready delivery
Gerber, drill, ODB++ or IPC-2581, plus a check report and a diff against the last version.
How AI is used
AI chooses the tools. Engines draw the wires.
Engineers give instructions in plain language, and a language model decides which steps to run. Tested, deterministic engines do every route and every check, so the same input always produces the same output, and every result can be explained.
"Route groups A, B and C
on layers S04–S08,
then check against the netlist."route A · 70/70 ✓
route B · 86/86 ✓
check 5,475 objects · 0 mismatchesResults
97% of a production card in under 40 minutes.
Time to route one test card
Benchmark from the founder's prototype on one production test card. The LADAZ bar is drawn slightly wider than scale so it stays visible. The 21 nets that were not routed were each reported to the engineer, along with the rule that blocked them.
Who it's for
Built for teams without
a packaging group.
AI chip and chiplet start-ups
Every new chip needs its own set of test cards, on schedules counted in weeks.
Small fabless companies
One or two new packages a year isn't enough work to justify a full-time designer.
OSATs and substrate vendors
Send us your overflow. We deliver in your rules, and you keep the manufacturing.
Roadmap
We start with test cards and build up to the substrate.
Test cards
The standard test cards every chip needs.
Load boards
Production test hardware, with ATE platform rules built in.
Substrates and interposers
Flip-chip, fan-out, 2.5D and chiplet packages.
High-end PCB
The same engine applied to complex boards.
Have a chip that needs hardware?
Send us your pin map and we'll tell you how fast we can turn it around. Investors and partners are welcome too.
hello@ladaz.tech